NF.Flux White Premium Flux Heat Resistant RoHS3 & J-STD-004B Compliant

NF.Flux White – Premium Fluid Flux (Heat Resistant, ROHS3 & J-STD-004B Compliant) NF.Flux White is the all new evolution of our premium flux line, engineered for technicians who demand maximum control, cleaner results, and superior performance under extreme heat. Built on the same trusted formulation and compliance standards as NF.Flux Premium, NF.Flux White introduces a thinner, more fluid consistency that flows effortlessly without gumming up or becoming sticky even during prolonged, high-temperature rework. Why NF.Flux White? Unlike traditional fluxes that thicken, burn, or turn sticky when exposed to heavy heat, NF.Flux White remains fluid and active, making it ideal for tight, crowded motherboard environments where cleanup and precision matter most. Its low viscosity formula allows the flux to: Flow evenly under components Spread smoothly without clumping Stay workable under sustained heat Clean easily without sticky residue This makes NF.Flux White especially well suited for BGA reballing, where consistent under chip flow is critical. Key Features • Thinner, more fluid formula for superior flow • Does not gum up or become sticky as easy, even under high heat • Excellent wetting action for clean, reliable solder joints • Ideal for tight and crowded motherboard areas • Superior performance for BGA reballing and rework • Flows evenly under BGA chips without residue buildup • Easy cleanup compared to thicker fluxes • Heat resistant formulation • ROHS3 & J-STD-004B compliant The Perfect Flux Combo For ultimate flexibility and performance, combine NF.Flux White with our original NF.Flux Premium. Using both NF.Flux and NF.Flux White gives you absolute full control over any soldering or rework job. Choose the thicker NF.Flux Premium when you need staying power and precision, and switch to NF.Flux White when even fluid spread, easy cleanup, and high heat stability matter most. Together, they cover every soldering scenario: • Precision microsoldering • High-heat rework • Tight, crowded motherboard areas • BGA reballing and under chip flow Needle and plunger included with every Syringe.