Solder Paste for Reballing and Soldering Applications Alloy Composition: Sn63/Pb37 Particle Size: 20-38 µm Weight: 50g Leaded Melting Point: 183°C This solder paste is designed with the ideal viscosity for reballing and soldering tasks, ensuring optimal flow and adhesion. It arrives in a fresh, wet state for easy application. Application Instructions: Apply the paste and spread evenly using a blade. Gently scrape off excess paste. Use a paper towel to wipe and dry the area. Apply heat as required for soldering. Always cover the paste container when not in use to prevent it from drying out. Store at normal room temp to maintain paste quality and performance.
